Florida Department of Education
Curriculum Framework 

Program Title:	Semiconductor Engineering Technology
Career Cluster:	Manufacturing 

Associate in Science	
CIP Number	1615061600	
Program Type	College Credit 	
Program Length	60 credit hours 	
CTSO	SkillsUSA	
SOC Codes (all applicable)	For program SOC codes, please see the Program and Course Tables section of the CTE Program Resources page linked below.	
CTE Program Resources 	http://www.fldoe.rg/academics/career-adult-edu/career-tech-edu/program-resources.stml	

Purpose

This program offers a sequence of courses that provides coherent and rigorous content aligned with challenging academic standards and relevant technical knowledge and skills needed to prepare for further education and careers in the Manufacturing career cluster; provides technical skill proficiency, and includes competency-based applied learning that contributes to the academic knowledge, higher-order reasoning and problem-solving skills, work attitudes, general employability skills, technical skills and occupation-specific skills, and knowledge of all aspects of the Manufacturing career cluster. 

The content includes but is not limited to electrical and digital circuits, installation and programming of robotic systems and silicon and wafer fabrication to include photolithography, plasma etching and advanced packaging. 

Additional Information relevant to this Career and Technical Education (CTE) program is provided at the end of this document.

Program Structure

This program is a planned sequence of instruction consisting of 60 credit hours.

When developing the course sequence for the local implementation of this program, select courses that:
•	Meet the skill development requirements of the standards and benchmarks of this program.
•	Meet the general education core course requirements of Rule 6A-14.0303, Florida Administrative Code.
•	Where reasonable and practicable, align with programs offered by your institution or other postsecondary institutions in Florida, including: 
o	Related CCC and ATD credentials.
o	Baccalaureate degrees within the same career pathway and/or Federal CIP code.

Visit FloridaShines’ Discover Programs website to identify other institutions that offer similar programs to review their course sequencing. Where appropriate, course alignment between institutions offering related programs can facilitate interagency student articulation.

Visit FloridaShines’ Common Prerequisites Manual to identify courses that are prerequisites for admission into an upper division program.  When sub-baccalaureate courses are aligned to the course admissions requirements of baccalaureate programs with the same career pathway, students can enter upper division coursework seamlessly.   

Florida’s Career Readiness Skills for CTE Programs

Employability Skills	
01.0	Apply academic skills to workplace scenarios.	
01.01	Use reading skills.	
01.02	Use writing skills.	
01.03	Use mathematical strategies and procedures.	
01.04	Use scientific principles and procedures.	
02.0	Design a solution to an industry problem.	
02.01	Use critical thinking.	
02.02	Use creativity.	
02.03	Make sound decisions.	
02.04	Solve problems.	
02.05	Reason. 	
02.06	Plan and organize.	
03.0	Manage resources within an industry project	
03.01	Manage time.	
03.02	Manage money or resources.	
03.03	Manage materials.	
03.04	Manage personnel.	
04.0	Oversee the subcomponents, operations and output of a technical or organizational system.	
04.01	Manage systems.	
04.02	Monitor systems.	
04.03	Improve systems.	
05.0	Use information for decision making.	
05.01	Locate information.	
05.02	Organize information.	
05.03	Use information.	
05.04	Analyze information.	
05.05	Communicate information.	
06.0	Apply relevant technology to workplace scenarios to aid productivity.	
06.01	Use technology.	
07.0	Interpret and express interpersonal communication.	
07.01	Communicate verbally.	
07.02	Listen actively.	
07.03	Comprehend written material.	
07.04	Convey information in writing.	
07.05	Communicate nonverbally.	
07.06	Interpret nonverbal communication.	
08.0	Interact with others to accomplish workplace goals.	
08.01	Collaborate with others in a team.	
08.02	Respond to customer needs.	
08.03	Exercise leadership.	
08.04	Negotiate to resolve conflict.	
08.05	Respect others.	
09.0	Manage personal behavior to maximize productivity and professional growth.	
09.01	Demonstrate responsibility and self-discipline.	
09.02	Adapt and show flexibility.	
09.03	Work independently.	
09.04	Demonstrate a willingness to learn.	
09.05	Demonstrate integrity.	
09.06	Demonstrate professionalism.	
09.07	Take initiative.	
09.08	Display positive attitude.	
09.09	Take responsibility for professional growth.	
Job Attainment	
10.0	Find, assess and apply to job opportunities.	
10.01	Identify online job posts relevant to his or her career aspirations.	
10.02	Compare and contrast the job posts’ required qualifications, job duties, compensation, benefits and employers. 	
10.03	Define what information, documentation and writing prompts are required for the positions.	
11.0	Communicate personal competence, character and fit for a job opportunity.	
11.01	Develop a resume.	
11.02	Write a cover letter.	
11.03	Curate a professional portfolio that includes work products.	
11.04	Prepare for and experience a mock job interview.	
12.0	Cultivate and leverage relationships to professionally advance.	
12.01	Request a signed reference letter, letter of recommendation and/or an online skill/professionalism endorsement. 	
12.02	Develop a plan to cultivate a professional digital footprint.	
12.03	Develop a networking plan for a specific industry of interest.	

Standards

After successfully completing this program, the student will be able to perform the following:

01.0	Demonstrate proficiency in laboratory practices.
02.0	Demonstrate proficiency in electrical circuits.
03.0	Demonstrate proficiency in digital circuits.
04.0	Demonstrate proficiency in programming, design and analysis of microprocessor/microcontroller-based systems.
05.0	Demonstrate proficiency in robotics, automation and installation.
06.0	Demonstrate an understanding of silicon and wafer fabrication.
07.0	Demonstrate safe clean room practices and policies.
08.0	Demonstrate an understanding of photolithography and pattern generation.
09.0	Demonstrate an understanding of plasma etching for wafer manufacturing. 
10.0	Demonstrate an understanding of metrology testing and applications.
11.0	Demonstrate an understanding of packaging and wafer level advanced packaging.
12.0	Demonstrate employability skills.

Florida Department of Education
Student Performance Standards

Program Title:	Semiconductor Engineering Technology 
CIP Number:		1615061600
Program Length:	60 credit hours

At the completion of this program, the student will be able to:	
01.0	Demonstrate proficiency in laboratory practices.  The student will be able to:	
01.01	Apply Occupational Safety Health Administration (OSHA) safety standards in an electronics laboratory environment when required.	
01.02	Analyze drawings and electronic schematics to make proper electrical and component connections and to also identify obvious faulty connections.	
01.03	Identify and use electrical/electronic hand and power tools (wire stripper, wire needle-nose clipper, solder and desolder station, etc.).	
01.04	Practice electrostatic discharge (ESD) safety procedures.	
01.05	Describe various applications of automation and robotics.	
01.06	Describe the construction of printed circuit boards (PCBs).	
01.07	Use circuit simulation programs to solve problems, verify circuit functionality and design circuits.	
01.08	Demonstrate the use of instrumentation and module analytical software.	
01.09	Read and interpret data sheet specifications for electronic components.	
01.10	Identify basic limitations of multi-meters, oscilloscopes, function generators and power supplies.	
01.11	Describe maintenance procedures, specifically in a total productive maintenance (TPM) in a manufacturing setting.	
01.12	Identify different types of personal protection equipment (PPE), their requirements and where they are used.	
01.13	Know the lock-out tag-out (LOTO) regulations.	
02.0	Demonstrate proficiency in electrical circuits.  The student will be able to:	
02.01	Describe the physical laws that govern electricity and magnetism.	
02.02	Identify sources of electricity.	
02.03	Define voltage, current, resistance, power and energy.	
02.04	Apply Ohm's law and power formulas to electrical/electronic circuits.	
02.05	Read and interpret color codes and symbols to identify electrical components and values.	
02.06	Measure properties of a circuit using Digital Multi-meter (DMM) and oscilloscopes.	
02.07	Calculate and measure the conductance and resistance of conductors and insulators.	
02.08	Solve problems in electronics utilizing metric prefixes.	
02.09	Apply Ohm's law and Kirchoff's voltage and current laws to solve series, parallel and series-parallel circuits.	
02.10	Construct and verify operation of series, parallel and series-parallel circuits.	
02.11	Analyze and troubleshoot series, parallel and series-parallel circuits.	
02.12	Apply Ohm's law and Kirchoff's voltage and current laws to bridge circuits.	
02.13	Construct and verify the operation of bridge circuits.	
02.14	Analyze and troubleshoot bridge circuits.	
02.15	Identify and define voltage divider circuits (loaded and unloaded).	
02.16	Construct and verify the operation of voltage divider circuits (loaded and unloaded).	
02.17	Analyze and troubleshoot voltage divider circuits (loaded and unloaded).	
02.18	Apply maximum power transfer theory to determine the conditions under which maximum power transfer occurs in a circuit.	
02.19	Construct and verify the operation of direct current (DC) and alternating current (AC) circuits that demonstrate the maximum power transfer theory.	
02.20	Describe magnetic properties of circuits and devices.	
02.21	Define resistor-capacitor (R-C) and resistor-inductor (R-L) time constants and classify the output of differentiators and integrators.	
02.22	Setup and operate power supplies for DC and AC circuits.	
03.0	Demonstrate proficiency in digital circuits.  The student will be able to:	
03.01	Define and apply numbering systems to codes and arithmetic operations.	
03.02	Analyze and minimize logic circuits using Boolean and Karnaugh Map (K-Map) operations.	
03.03	Demonstrate proficiency in the use of logic probes for digital circuits.	
03.04	Describe the various logic families and their electrical characteristics, e.g., Transistor-Transistor Logic (TTL), Complimentary Metal-Oxide Semiconductor (CMOS), etc.	
03.05	Use pulsers/pulse generators/clock signals to drive the inputs of digital circuits.	
03.06	Use oscilloscopes to analyze and troubleshoot digital circuits.	
03.07	Use logic analyzers to analyze and troubleshoot digital circuits.	
03.08	Determine the fan-out of digital circuits based on integrated circuits (IC) limitations.	
03.09	List the various types of logic gates and their truth tables.	
03.10	Construct combinational logic circuits using IC.	
03.11	Troubleshoot combinational and sequential logic circuits.	
03.12	Identify and analyze types of flip-flops and their truth tables.	
03.13	Construct flip-flops using IC.	
03.14	Troubleshoot flip-flop circuits.	
03.15	Identify types of registers and counters.	
03.16	Construct registers and counters using flip-flops and logic gates.	
03.17	Troubleshoot registers and counters.	
03.18	Analyze, construct and troubleshoot clock and timing circuits.	
03.19	Identify, construct and troubleshoot adder/subtractor logic circuits.	
03.20	Identify, construct and troubleshoot encoders and decoders.	
03.21	Identify, construct and troubleshoot multiplexer and demultiplexer circuits.	
03.22	Identify types of memory circuits.	
03.23	Describe and examine the uses of digital-to-analog and analog-to-digital conversions.	
03.24	Construct and troubleshoot digital-to-analog and analog-to-digital circuits.	
03.25	Identify, construct and troubleshoot digital display circuits.	
03.26	Program Programmable Logic Devices (PLD).	
04.0	Demonstrate proficiency in programming, design and analysis of microprocessor/microcontroller-based systems.  The student will be able to:	
04.01	Analyze the connections for interrupt driven input/output.	
04.02	Write a machine-level program and verify correct operation of simple input/output devices.	
04.03	Analyze and draw a timing diagram showing all pertinent bus signals in a microprocessor/microcontroller system.	
04.04	Use timing diagrams to analyze the instruction cycle of a microprocessor/microcontroller. 	
04.05	Program and interface input/output devices.	
04.06	Program and interface a data link (e.g., serial, parallel, USB) using a microprocessor/microcontroller.	
04.07	Write programs in a high-level language (e.g., C, C++, or C#) using data movement, logical and shifting instructions.	
05.0	Demonstrate proficiency in robotics, automation and installation.  The student will be able to:	
05.01	Describe the major parts and operation of a robotic system.	
05.02	Explain and use sensors used in robotics applications.	
05.03	Describe proportional and derivative feedback control systems.	
05.04	Explain communication protocols (e.g., Ethernet, networks, communication busses)	
05.05	Write control programs for robots.	
05.06	Download programs to robots and test them.	
05.07	Describe the architecture and provide a system overview for the hardware and software found in a typical automated work cell.	
05.08	Describe, analyze and interpret typical Programmable Logic Control (PLC) ladder logic programs.	
05.09	Demonstrate the proper installation of hardware and software 	
05.10	Demonstrate programming the robot to go to the calibration position.	
05.11	Demonstrate correct alignment and leveling of the robot.	
05.12	Confirm absence of vibration.	
05.13	Demonstrate proper cable management.	
05.14	Demonstrate full range of motion and reach study check.	
05.15	Demonstrate safety settings including safety modes.	
05.16	Describe safety Checksum and its purpose.	
05.17	Demonstrate the proper installation of an End of Arm Tool (EOAT).	
05.18	Describe the role of sensors and demonstrate the proper installation of sensors. 	
05.19	Describe the role of actuators and demonstrate the proper installation of actuators.	
06.0	Demonstrate an understanding of silicon and wafer fabrication.  The student will be able to:	
06.01	Define silicon and other semiconductor substrate materials and describe its use.	
06.02	Define and understand a transistor.	
06.03	Describe the basics of wafer fabrication.	
06.04	Define and understand Moore’s Law.	
07.0	Demonstrate safe clean room practices and policies.  The student will be able to:	
07.01	Demonstrate clean room practices to include gowning and de-gowning routines.	
07.02	Know how to read safety data sheets (SDS) and identify necessary information.	
07.03	Demonstrate proper wafer handling techniques.	
07.04	Demonstrate the need for contamination control.	
08.0	Demonstrate an understanding of photolithography and pattern generation.  The student will be able to:	
08.01	Define photolithography and its use in wafer manufacturing 	
08.02	Define pattern generation as it relates to wafer fabrication.	
08.03	Define and demonstrate Statistical Process Control (SPC).	
09.0	Demonstrate an understanding of plasma etching for wafer manufacturing. -- The student will be able to:	
09.01	Define Plasma and Plasma Etch methods and equipment (e.g., reactive ion etch, inductively coupled plasma (ICP)).	
09.02	Demonstrate a visual check of plasma process conditions.	
09.03	Demonstrate an understanding of theory and equipment for End Point Detection.	
09.04	Demonstrate an understanding of wet, dry and thermal wafer process procedures.	
09.05	Demonstrate an understanding of plasma deposition in wafer fabrication.	
10.0	Demonstrate an understanding of metrology testing and applications.  The student will be able to:	
10.01	Demonstrate visual and instrument checks of wafer film thickness and statistical uniformity.	
10.02	Know and identify common wafer defects.	
10.03	Demonstrate an understanding of how the following metrology tools work and the data they provide. (e.g., Scanning Electron Microscope (SEM), Film Thickness Monitor, Laser surface Profilometer and Roughness, Stylus Profilometer)	
10.04	Demonstrate an understanding of electrical wafer probing.	
11.0	Demonstrate an understanding of packaging and wafer level advanced packaging.  The student will be able to:	
11.01	Define and describe singulation, die pick and place and wire bond.	
11.02	Define types of single die packaging.	
11.03	Define and describe advanced packaging and interposer technologies.  	
12.0	Demonstrate employability skills.  The student will be able to:	
12.01	Conduct a job search. 	
12.02	Secure information about a job. 	
12.03	Identify and create documents that may be required when applying for a job to include a professional resume. 	
12.04	Complete a job application form correctly after identifying appropriate job descriptions. 	
12.05	Demonstrate competence in job interview techniques. 	
12.06	Demonstrate knowledge of how to make appropriate decisions and judgements. 	
12.07	Demonstrate appropriate work/behavioral habits. 	
12.08	Demonstrate acceptable employee personal hygiene and health. 	
12.09	Demonstrate knowledge of the Occupational Safety and Health Standard 29CFR-1910.1200, Hazard Communication.	

Additional Information

Laboratory Activities

Laboratory investigations that include scientific inquiry, research, measurement, problem solving, emerging technologies, tools and equipment, as well as, experimental, quality, and safety procedures are an integral part of this career and technical program/course. Laboratory investigations benefit all students by developing an understanding of the complexity and ambiguity of empirical work, as well as the skills required to manage, operate, calibrate and troubleshoot equipment/tools used to make observations. Students understand measurement error; and have the skills to aggregate, interpret and present the resulting data. Equipment and supplies should be provided to enhance hands-on experiences for students.

General Education Course Requirements for AS and AAS Degrees

State Board of Education Rule 6A-14.030(4), F.A.C., identifies 15 credit hours as the minimum amount of general education coursework required in the Associate of Science (AS) degree and the Associate of Applied Science (AAS) degree.  In addition, Rule 6A-14.0303, F.A.C., implements s. 1007.25, F.S., and requires students entering a technical education degree program in the 2022-2023 academic year, and thereafter, to complete at least one identified core course in each subject area as part of the general education course requirements (15 credit hours total) before a degree is awarded) The core subject areas include: 
•	Communication. 
•	Humanities.
•	Mathematics. 
•	Natural Sciences.
•	Social Sciences.

Career and Technical Student Organization (CTSO)

CTSOs are co-curricular career and technical student organizations providing leadership training and reinforcing specific career and technical skills. Career and Technical Student Organizations provide activities for students as an integral part of the instruction offered. Other CTSOs not listed in this curriculum framework or recognized by the Florida Department of Education are permissible provided they support student mastery over the standards and benchmarks of this curriculum framework.

Accommodations

Federal and state legislation requires the provision of accommodations for students with disabilities to meet individual needs and ensure equal access. Postsecondary students with disabilities must self-identify, present documentation, request accommodations if needed, and develop a plan with their counselor and/or instructors. Accommodations received in postsecondary education may differ from those received in secondary education. Accommodations change the way the student is instructed. Students with disabilities may need accommodations in such areas as instructional methods and materials, assignments and assessments, time demands and schedules, learning environment, assistive technology and special communication systems. Documentation of the accommodations requested and provided should be maintained in a confidential file.

Certificate Programs

A College Credit Certificate consists of a program of instruction of less than sixty (60) credits of college-level courses, which is part of an AS or AAS degree program and prepares students for entry into employment (Rule 6A-14.030, F.A.C.). This AS degree program includes the following College Credit Certificates:

Semiconductor Cleanroom Operator (0615061601) - 18 credit hours

Standards for the above certificate programs are contained in separate curriculum frameworks.